Introduction Intellectual Property is a way of protecting technologically invented rights. Various forms of creation…
In a further step towards the development and strengthening of Intellectual Property regime of both Cambodia and China, a Memorandum of Understanding (MoU) on Branding Cooperation between the Ministry of Commerce of the Kingdom of Cambodia and National Administration of Industry and Commerce of the People’s Republic of China was signed on September 06, 2017 . This MoU aims at providing better facilities for trademark and brand registration in both countries.
The MoU signing ceremony took place in the city of Phnom Penh which is the capital of the Kingdom of Cambodia and was held under the presidency of HE OukPrachea, Secretary of State, Ministry of Commerce, High Representative of HE Peng Sosachak, Minister of Commerce, and HE Ma Zhengqi, Deputy Minister of National Administration of Industry and Trade of the People’s Republic of China. This MoU will further serve the purpose of strengthening and broadening cooperation between China and Cambodia on an equal and mutually beneficial basis in the Markets, and to also promote the growth of more brands in the respective nations. Additionally, the memorandum will protect consumers and producers’ interests.
This MoU is in continuation with the previous Memorandums  which have been signed between Cambodia and China for bilateral cooperation in Intellectual properties. In the press releasedated September 6, 2017, on the online portal of Cambodia it is stated that, through this Memorandum both China and Cambodia willshare the related documents of intellectual property and also include mutual study visits to strengthen intellectual property regime and trade protectionism. Further under this MoU, China through their experts will be helping in the training of human resources to Cambodia on brand protection and brand control. In addition, China will also in the promotion of Cambodian products exhibitions, as well as building more of Cambodia’s brand in the market.
Author: ShilpiSaxena, Jr. Patent Associate at Khurana & Khurana Advocates and IP Attorneys can be reached at [email protected].